PV production: 1366 Technologies introduces “3D” solar wafer feature

1366 Technologies (Bedford, Mass., US) on August 16th, 2016 unveiled the first of a series of R&D achievements: The company’s proprietary Direct Wafer process has demonstrated the ability to grow a “three dimensional” wafer or a thin wafer with a thick border. This advancement is impossible with conventional ingot-based production technologies, 1366 notes. According to the company the 3D feature further reduces the amount of silicon required for each wafer without sacrificing strength, durability or performance. It also allows the crystalline silicon PV supply chain to lower costs while leveraging its existing infrastructure.

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